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Product Analysis

The mission of the Product Analysis Group is to provide high quality analysis in a timely manner to support new product introductions, continuous improvements, and resolution of any customer issues.

The Product Analysis Group provides nondestructive and destructive electrical and physical data on products throughout their life cycle. This data is used to drive corrective actions and generate continuous improvement in all RFMD processes.

Locations

RFMD possesses three main laboratories worldwide that are capable of product analysis down to the component level.

  • Greensboro, N.C. (Corporate headquarters)
  • Beijing, China
  • Newton Aycliffe, UK
Failure Analysis Locations

Process Flow for Product Returns for Failure Analysis (RFA)

RFA Process

For additional information on returning product for analysis, please refer to our Process for Product Returns for Failure Analysis.

Laboratory Capabilities

  • Non-Destructive Analysis
    • Electrical Verification
    • X-Ray Analysis
    • Scanning Acoustical Microscopy
  • Destructive Analysis
    • Cross Sectioning
    • Circuit Modification
    • Transmission Electron Microscopy
X-ray image of PA module
X-ray image of PA module
Si die with FIB inserted transistor probe points
Si die with FIB inserted transistor probe points

Quality

RFMD® Corporate Headquarters & GaAs HBT Fabrication Facilities7628 Thorndike RoadGreensboro, NC 27409-9421
Main Phone: 336.664.1233
Customer Service: 336.678.5570
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