| Type |
Title / Description |
Published |
|
RF MMMB PA Options TDD & FDD LTE Global Roaming
RFMD’s 1st generation MMMB PA has been in production since 2011. RFMD’s 2nd generation MMMB PA will ramp at the end of this year. RFMD’s 3rd generation MMMB PA will sample in 1Q13. RFMD’s SB PAs for B40 & B41 and a 2.3 - 2.7GHz Multi-Band PA are bein More... |
Nov 2012 |
|
High Power GaN Solutions for Next Generation Radar
GaN-on-SiC technology adoption continues for high power commercial and military radar applications.
High efficiency GaN amplifiers provide robust, reliable solutions addressing need for more power in same footprint OR same power in smaller footprint More... |
Oct 2012 |
|
Broadband GaN MMICs: Multi-Octave Bandwidth PAs to Multi-Watt Linear LNAs
Need: BW, Power, Linearity, PAE, Sensitivity, Survivability
Broadband Application
GaN Flavors (fT, Lg, BVdg, LN, Power Density)
Broadband Amplifier Topology – Trades
•Cascode FB
•Darlington FB
•Lossy Match
•DA and NDPA
Recent Results |
Oct 2012 |
|
High Power GaN Solutions for Next Generation Radar
GaN-on-SiC technology adoption continues for high power commercial and military radar applications. High efficiency GaN amplifiers provide robust, reliable solutions addressing need for more power in same footprint OR same power in smaller footprint. More... |
Oct 2012 |
|
GaN High Power Amplifiers: Optimal Solutions Addressing Pico to Macro BTS Demands
Next Generation Products?
• Linearity Optimized
• Integration where beneficial
• Size/Efficiency optimized for small cell designs
• Higher Frequency Designs
Why GaN?
• High peak efficiency
– Peak efficiency ~70%
– Correlation with high power More... |
Oct 2012 |
|
Thin-Film Lithium Niobate Contour-Mode Resonators
•With the flexibility lithography-defined resonator geometry, we demonstrated multi-frequency resonators on a single chip
•Two resonators at two different frequencies are demonstrated: 463MHz resonator: kt2*Qs = 105, Qs = 1500, kt2 = 7%; 750MHz reso More... |
Oct 2012 |
|
Matching a 60 W GaN HEMT over 100–1000 MHz Bandwidth
Emerging SDR architectures require wideband, high power
amplifiers with high efficiency, compact size and low cost. GaN-on-SiC technology adoption continues for high power
commercial and military applications. We’ve matched a 60W GaN HEMT over a 1 More... |
Sep 2012 |
|
Package Reliability Monitored Drop Shock and Temperature Cycling Testing Progression and Advantages
Package Reliability Monitored Drop Shock and Temperature Cycling Testing Progression and Advantages
Evolution of RFMD Technology in Relation to Reliability
Monitored Drop Shock
Monitored TC
Continued Trends |
Sep 2012 |
|
Accurate Prediction of Thermal Resistance of FET by Detailed Modeling of Heat Generation and Backend Stackup
Joule Heating and FET structure
Heat Distribution and Averaging Schemes
Backend Topology Modeling
FET3 FEA Model
Results and Discussion
•Effect of Various Heat Averaging Schemes
•Effect of Backend Stackup Layers
•Estimate Tj based on T_surf |
Sep 2012 |
|
GaN Low Noise Broadband Amplifiers and Technology
Low Noise GaN HEMT Technology
•Device Design
•NF characteristics- NG
•Survivability
•Trends in Literature
Broadband S-/C-band LNA Design
•Wide-band Linear Applications
•Design Topology Trades
•Linear Cascode LNA example
•Technology Compari More... |
Jun 2012 |
|
Emerging Market Opportunities For GaN
GaN-on-SiC technology adoption continues for high power commercial and military applications.
High efficiency (GaN1) and high linearity (GaN2) transistor technologies developed for high peak power and high peak-to-average power operation.
Superior More... |
Jun 2012 |
|
Bias Optimized IP2 & IP3 Linearity and NF of a Decade-Bandwidth GaN MMIC Feedback Amplifier
This work investigates the optimum NF, IP2, and IP3 bias of a GaN Cascode Amplifier |
Jun 2012 |
|
A 50MHz-16GHz Low Distortion SOI Voltage Controlled Attenuator IC with IIP3 > +38dBm and Control Range of > 25dB
Broadband Voltage Controlled Attenuator
•General Purpose and wideband up to 16GHz apps
•Test equipment, military equipment, wideband apps
•Very high linearity IIP3 > +38dBm
•Attenuation range > 25dB
•Temperature compensated
•Linear in dB contro More... |
Jun 2012 |
|
Multi-Octave Practical Power Amplifier Realization using GaN on SiC
Emerging SDR architectures require wideband, high power amplifiers with high efficiency, compact size and low cost. GaN-on-SiC technology adoption continues for high power commercial and military applications.
Demonstrations include:
•90W (dual d More... |
Jun 2012 |
|
Design and Simulation of Integrated, High-Efficiency Power Amplifier Modules
Handset power amplifier design is challenged by continuous cost and size reduction. Part of cost reduction can be achieved by faster time to market and less design iterations. By using advanced design and simulation techniques, it is possible to achi More... |
Jun 2012 |
|
Silicon-on-Insulator (SOI) Switches for Cellular and WLAN Front-End Applications
•3G / 4G smart handsets will dominate the market in the next few years, which opens a great opportunity for front-end suppliers.
•High resistivity SOI enables FET stacking, allowing the design of high power antenna / mode switches.
•Low RON*COFF pr More... |
Jun 2012 |
|
RF PA Options for 2.3-2.7 GHz LTE Bands
RF suppliers are ready to support TD-LTE. Broadband 2.3-2.7GHz PAs are available to support Option #1 -or- Option #2. High isolation & Low Insertion Loss switches are available today. B7 PAs are available today. RF Industry has not fully standardized More... |
Jun 2012 |
|
Broadband Lumped Package Modeling for Scaling Multi-Cell GaN HEMT Power Devices
The lumped approach to establish a package model for multi-cell GaN devices is presented. EM simulated s-parameters are matched to that measured on open and short structures. Initial lumped equivalent R-L-C elements are obtained by studying scaling b More... |
Jun 2012 |
|
Transient Latch-up in Large NFET Switch Arrays
Power management products are becoming increasingly common for handheld consumer products. These present unique problems in managing the snapback and subsequent failure of the large NMOS array. Two different mechanisms have been identified that are r More... |
May 2012 |
|
Use of Knowledge Discovery from Manufacturing Data for Yield Improvement
In order to quickly identify likely causes to manufacturing issues, a KDD approach should be taken to Assemble, Fix and Explore existing data. The output of the process can be fully automated for common issues. By using the KDD process at RFMD, many More... |
Apr 2012 |
|
Fundamental Failure Mechanisms Limiting Maximum Voltage Operation in AlGaN/GaN HEMTs
•Proposes a method of determining Safe Operating Area (SOA) of GaN Power Devices in a high voltage OFF-state.
•Describes fundamental failure mode limiting OFF-state SOA.
•Describes a new test method to safely extract failure times for device operat More... |
Apr 2012 |
|
RF Front End Challenges for 3G/4G Wireless Handsets
RF Front End Challenges for 3G/4G Wireless Handsets |
Mar 2012 |
|
ESD Solutions for Mature CMOS Technologies
I.Introduction to the ESD Association
II.Issues Facing the ESD Design Engineer in the Current Economy
III.Case Studies
I.ESD in Thin SOI
II.ESD in “Noisy” Environments
III.The “Middle Earth” of ESD Mitigation |
Mar 2012 |
|
Tomorrow's RF Chips for Mobile Devices
• Increases in mobile data usage is driving new system
efficiency expectations for RF components in handsets
• New modulation schemes require more advanced power management to meet battery life expectations in mobile devices
• Mobile devices must More... |
Mar 2012 |
|
Using Alternate Manufacturing Methods for Rapid Prototyping of Test Sockets
The need to create a unique test socket for limited use or an experimental socket comes up on occasion. Using rapid prototyping manufacturing methods a prototype socket can be designed and manufactured in as little as one day. |
Mar 2012 |
|
GaN Output Matching Network Comparison
Fully matched GaN Power Transistors incorporate optimized matching networks
that provide wideband power performance in a single amplifier and give the user high terminal impedances that allow for ease of use |
Feb 2012 |
|
Broadband Reconfigurable Matching Network of Reduced
Dimensions for the UHF Military Satellite Communication Band
Good impedance match between transmitter and antenna is needed to maximize radiated power
Antenna impedance varies significantly in portable equipment
A reconfigurable matching network between the transmitter and the antenna can overcome this p More... |
Feb 2012 |
|
DC/DC Converter Controlled Power Amplifier module for
WCDMA Applications
Integrated PA module with DC/DC converter is demonstrated. Overall PA module size is 6x6mm. Closed loop type of power detector is presented. DC/DC buck converter controls VCC2 of PA. PAE has been improved from 8.6% to 16.8% @ 16dBm. PAE at peak power More... |
Feb 2012 |
|
Defining Application Spaces for High Power GaN
Exploring the options for GaN
• Value Proposition
• Market Segments
Product alignment
• Timing is NOW! Data is REAL!
• Enabling Wide Bandwidth
• Enabling Very High Power
• Enabling Future Infrastructure
• Enabling High Efficiency |
Feb 2012 |
|
An 8-Watt 250-3000 MHz Low Noise GaN Feedback Amplifier MMIC with > +50 dBm OIP3
Future GaN Trends, GaN Linear Applications. Demonstrates a new linearity benchmark for GaN MMIC LNAs. |
Feb 2012 |
|
A Robust AlGaN/GaN HEMT Technology for RF Switching
Applications
Advantages of GaN Materials for RF Switching
Background on GaN reliability
OFF-State Step Stress Experiment |
Feb 2012 |
|
A 1mm Two Stage LNA and SP2T Switch RFIC FEM for WLAN 802.11a Application
Motivation:
Low Cost, Low NF LNA for high band WLAN 4.9-5.85GHz
Highly integrated MMIC single chip solution for PA/LNA/Switch
Outline:
pHEMT device Noise Figure FOM
RFMD E/D-mode pHEMT Device Noise Figure Characteristics
RF5540 LNA desi More... |
Jan 2012 |
|
Doherty Power Amplifier Design
With high peak to average ratio signals in full use in the commercial world and expanding in the military world, how do we efficiently amplify these signals?
Doherty is old news! PA suppliers are getting very nearly equal results. “Optimizations”/ More... |
Nov 2011 |
|
Improving the Manufacturability of High-Power AlGaN-GaN HEMTs Using Statistical Analysis and Data Mining Techniques
The advantages of GaN for High Power applications are well known:
• High Breakdown Voltage, Wide Bandgap, High Thermal Conductivity with SiC substrates, High Current Density.
• GaN based products have ramped in volume as industry became more comfor More... |
Nov 2011 |
|
Module Assembly Spacing Design Rule Improvement Study
for Flip Chip Device Applications
1. Module package size reduction approaches
2. Test vehicle and considerations
3. Assembly for qualification and reliability |
Nov 2011 |
|
A Decade Bandwidth 90 W GaN HEMT Push-Pull Power Amplifier for VHF / UHF Applications
Market Drivers
• Improve battery life
• Multi-standards for inter-operability
• Wide-band architecture
• Improve reliability
• Leverage COTS components
Why GaN?
• Higher efficiency
– Reduce heatsink requirements, smaller size
– Increase ba More... |
Oct 2011 |
|
A novel clamp based ESD protection structure for high power RF ports in GaAs pHEMT process
• ESD Protection Techniques
• ESD for RFICs - GaAs and ESD
• Conventional Diode Stack ESD Circuit
• Dual pHEMT Clamp
• Clamp Schematic and Working
• Transmission Line Pulse Measurement
• Clamp Capacitance
• WiFi FEM - Measured Results |
Oct 2011 |
|
High Power & Wideband GaN RF Switch Technology
RFMD Has Demonstrated RF switches w/
–Record Power Handling Capability
–Wide Bandwidth Performance
–Reliable Switch FET Technology |
Jul 2011 |
|
VHF Doherty Amplifier with GaN FETs and Independent Drive-signal Control
A VHG Doherty amplifier with independent drive-signal control is presented based upon a lumped-element design at which the PA #1 operates in class-B achieving and efficiency of 63% while the PA #2 is biased for class-C operation with an efficiency of More... |
Jun 2011 |
|
A Broadband High Dynamic Range Voltage ControlledAttenuator MMIC with IIP3 > +47dBm over Entire 30dB Analog Control Range
Broadband Voltage Controlled Attenuator
CATV & Wireless Infrastructure Bands
Very high linearity IIP3 > +47dBm
Attenuation range > 30dB
Well controlled over PVT
Linear in dB control
Low Cost
MMIC implementation
Eliminate pin diodes
Low Curre More... |
Jun 2011 |
|
Advancements in GaN Technology
GaN Benefits overview
GaN Doherty Results
GaN Drain Modulation |
Jun 2011 |
|
Broadband Design Techniques and Technology for Future Wireless and Wireline Applications
Evolution of the RF Darling Amplifer
• Design Technology
• New Technology
100 Gbps Fiber Optics
Broadband Linear GaN Design
• SDR LNA & PA
• CATV amplifer |
Nov 2010 |
|
Study of Grounding Schemes Utilized in Conformal Shielding Applications
Comparison of shielding technologies. Discussion of laminate design. Description of testing and shielding performance. |
Nov 2010 |
|
A 0.1 – 1.8 GHz, 100 W GaN HEMT Power Amplifier Module
Emerging Software Defined Radio Architectures
• Public Mobile Radio
• Joint Tactical Radio Systems (JTRS)
• Jamming Applications
Requirements
• Multi-decade10W and higher
• High efficiency & compact size PAs critical for handheld / mobile uni More... |
Oct 2010 |
|
Innovative Techniques for Shielding RF Components at the Package Level
• Why integrate a shield in the module?
• Shielding Techniques
• Shielding Performance
• Reliability |
Sep 2010 |
|
Realizing Doherty Power Amplifier Designs
Doherty is old news! PA suppliers are getting very nearly equal results. “Optimizations”/“tweaks” are simply exploiting tradeoffs.
Textbook Doherty Design Principles
• Definition of Terms
• The “Classic” Concept
Empirical Doherty Design
• Se More... |
Sep 2010 |
|
Multi-mode, Multi-band RF Front End Challenges and Solution
• Future Device Market Drivers
• Engineering Challenges for Multi-Mode, Multi-Band (MM/MB)
• MM/MB Converged Solution
• MM/MB Converged Performance |
Jun 2010 |
|
Radio Front End for Enhanced Data Rate at Cell Edges
3G HSDPA/HSUPA Data rate at the edge of the cells are dropping much faster than expected versus the simulation done at the network
planning side.
What RF Front End architectures can be considered to help improve the data rate that a mobile user c More... |
Jun 2010 |
|
Cellular Antenna Switches for Multimode Applications Based on a Silicon-On-Insulator (S-O-I) Technology
• Silicon-on-Insulator (SOI) for Antenna Switches
• Design of High Order Switches on SOI
• Small Signal Measurements
• Harmonics and IMD Performance
• Spurious Emissions |
May 2010 |
|
GaN: Applications in RF Systems Beyond The PA
• Properties of GaN
• System Challenges
• System Advantages Afforded by GaN
• GaN Components |
Mar 2010 |
|
A Low-Noise Frequency Synthesizer for Infrastructure
Applications
Fully integrated synthesizer fabricated in 0.18um SiGe BiCMOS process using a switch-capacitor array for wideband tuning
VCO phase noise of -134dBc/Hz at 600kHz
CP is capable of having an output voltage in excess of 6V albeit the breakdown volt More... |
Jan 2010 |
|
A 1mm flip-chip SP3T switch and low noise amplifier RFIC FEM for 802.11b/g applications
Motivation
• Customer demand is driving mobile handsets to be smaller while adding functionality, specifically WLAN radios
• This requires the radio front ends to be much smaller in footprint area but still perform well
Challenge
• To design a More... |
Jan 2010 |
|
RF MEMS Switch Technology for Radio Front End Applications
• Cellular system evolution
• Tunable RF Front Ends
• RFCMOS-on-SOI technology
• RFMD MEMS Switch Technology
• Measured DC / RF / Reliability Characteristics |
Jan 2010 |
|
The Evolution and Importance of Composition in RF Compound Semiconductors
• What is composition?
• Where we started
• MESFET to pHEMT
• HBT born of composition and then improved
• GaN HEMT – all about composition
• SiGe, yes even for silicon |
Oct 2009 |
|
Devices and Design Techniques for Advanced Handset / Mobile PAs
Highly Integrated Wireless Handset Front-End Modules Based on Bulk Silicon and Silicon-on-Insulator (SOI) Technologies
• Technology Description
• IPMOS (Integrated Power MOS) Device
• SOI for Switch Enablement
• IPMOS PAs and Integrated DC-DC Con More... |
Jun 2009 |
|
Multi-Decade GaN Cascode-Distributed Power Amplifiers with Baseband Performance
Demonstrates two GaN MMIC DA designs with base-band to 24 GHz
-Conventional cascode DA
-All-pass capacitively coupled cascode DA |
Jun 2009 |
|
Extrinsic Parameter and Parasitic Elements in III-V HBT and HEMT Modeling
• General modeling flow for single and multi-cell array device modeling
• Analysis of test structures with corresponding calibration techniques
• De-embedding
• Methods for extrinsic parameter extraction used in HBT and pHEMT modeling
• Parasitic More... |
Jun 2009 |
|
Memory Effects Measure for Improved Digital Predistortion Tuning
• APPD is not a “Silver Bullet” for DPD tuning
• Neither is PAR
• APPD does show some correlation to DPD ACP and with PAR can help guide the tuning
• EVMrms shows potential worthy of follow-up
• Captures both AM/AM and AM/PM |
Apr 2009 |
|
Bias-Induced Memory Effects in UHF Wideband Power Amplifiers
• Introduction to memory effects in RF power amplifiers
• Causes of memory effects related to bias networks
• Design of bias networks that minimize performance degradation due to memory effects
• Practical and conceptual approach |
Jan 2009 |
|
200W GaN Broadband, Quick-Turn Doherty Amplifier
• The Doherty configuration is the current “topology of choice”
• Given enough time, one can optimize and trade gain and bandwidth for efficiency
• Sometimes, the quickest solution is the best
• Solid/robust amplifier design techniques combined wi More... |
Dec 2008 |
|
RC Clamps for “Noisy” Supply Rail Environments
A novel latch-enabled ESD clamp which incorporates feedback to enhance clamping and releasing capabilities is presented. In an ESD event, the RC trigger switches the clamp to a low-impedance state at which time the feedback circuit latches the clamp More... |
Jul 2008 |
|
Large-Signal Measurements for Power Amplifier (PA) Characterization
• Presented an evolution of different PA measurements from simple power sweeps to load/source-pull with modulated waveforms.
• Demonstrated two principal uses of PA data for the system.
• PA performance compliance.
• PA modeling.
• Showed the adv More... |
Jun 2008 |
|
Open Loop Large Signal Polar Modulation for EDGE 8PSK
Overview of the Polaris 2 transceiver architecture.
Comparison of different modulation methods
• IQ and small signal polar modulation
• Open and closed loop large signal polar modulation
Example performance results
The next generation |
Jun 2006 |
|
Modulation Trends and Key Specifications of Mobile
Transmitters
With the emergence of 3GPP digital standards for mobile communications, the battery power available to the mobile transmitter will be limited as the mobile phone will have to power
MP3 players, higher resolution graphic displays and more powerful pr More... |
Jun 2006 |